- Joined
- Sep 13, 2007
- Messages
- 225 (0.04/day)
System Name | Suteki Ryzen |
---|---|
Processor | AMD Ryzen 3900 @ Stock |
Motherboard | MSI Tomahawk B450 MAX |
Cooling | Stock Box Cooler |
Memory | 32gb ( 2x16gb) 3600mhz DDR4 G.Skill 16-19-19-39-58 |
Video Card(s) | MSI GeForce RTX 2060 6GB Ram |
Storage | 256gb nvme SSD, 250GB SATA3 SSD, 480GB USB3 SSD, 750GB SSHD, 3TB WD Red HDD |
Display(s) | Asus VE220 / Epson TW-3000 1080p projector |
Case | Raijintek Thetis Black |
Audio Device(s) | Asus Xonar D1 PCI on a PCIe-to-PCI Adapter |
Power Supply | EVGA 550G2 |
Mouse | Razer DeathAdder 2013 |
Software | Windows 10 Pro |
Hey guys; now we have summer and the temperatures are rising and I for one am sick of hearing the PS3 (60GB-US, the one with EE+GS) kick into the 4th or even 5th Gear of Fan-level. So I decided to upgrade the thermal dissipation with the lovely AS5, but I'm not quite saddisfied with the result. (I had better results on another PS3 with Liquid Metal Pad, but those are too expensive and not at hand right now)
So anyhow, to the point at hand. Some of you might be familiar with the heat-dissipation-system of the PS3, but for those who aren't, here are some details:
The whole thing still assembled, minus the 160mm fan:
http://img186.imageshack.us/my.php?image=dscn1346sr9.jpg
Both the Cell and the RSX are protected by a heatsink; while the cell is your usual (rather long) core below the heatsink, on the rsx there are 4 GDDR3-chips in each of the 4 corners of the whole chip.
http://img242.imageshack.us/img242/4148/chipsso5.jpg
The heatsink itself is made out of 2 parts, one for the CPU, which is the big part and a small part for the GPU, I think this picture says it all: http://images.dailytech.com/nimage/3000_large_heatsink.jpg (look at the ugly amount of grease stacking up)
The heatsink is fastened on the chips, by some clamps on the other side of motherboard (with other words; it gets "pulled" towards the chips). http://www.consolezombie.com/Images/SonyPS3Disassembly/ps3-heatsink-bracket-screws.jpg
Now, the problem is once you attach the heatsink, you can't move it... This makes so, that I can't twitch the HS to spread the blob/line; is that a big problem or would the Heatsink still do the spreading well enough? Would the break-in help out with that? By using the line-method on the cell and 5 blobs on the rsx (rice-corn in the middle and 4 of about 1/4 the size in each of the corners) managed to avoid fan-stage 5 which it reached with the standard paste; but stage 4 is still too much/loud...
Given I was not happy with the results I went ahead and tried the "spread it yourself"-thing, by wrapping my finger into a plastic bag and creating a nice and even layer. To my happyness this seemed to work quite a bit better, in fact it reached stage 4 a lot later (around 15 minutes later). Still reaching it was not acceptable, so I opened it, to find the CPU Heatsink perfectly covered with AS5, but the GPU-Heatsink barely even touched the RSX :shadedshu I'm sure it was not a mounting mistake as even when I tryed to reseat it, the gpu would not really get into contact with the heatsink, which also explains the tremendous amount of grease Sony put on those chips.
What would you guys do in this situation? I thought about using the "spread it yourself" on the cell, while using the blob (actually 5 blobs, one the size of an uncooked rice corn in the middle and 4 a 1/4 of the size of it on each corner) on the RSX. But then again, when I think about how the Cell got hot, without spreading it myself, I feel kinda unhappy with that choice, or do you think this behaviour would clear up over time (break-in period, I always only tried each config for 2 hours, each with a 20 minute "cool down phase" after the first of the 2 hours.
Is there any way to accelerate the break in, as in get the PS3 really hot (unplug fan/block vents) and let it cool of again once it reaches around stage 10 of fan-level (which is the last before the security turn-off kicks in; I had to do that to burn-in the LMPs on another PS3)?
P.S. Anyone saying something about "dood never open a console", or the like, should just stfu and get out of this thread.
And anyone giving a constructive reply will obviously be rewarded with a "Thanks" and my gratitude!
So anyhow, to the point at hand. Some of you might be familiar with the heat-dissipation-system of the PS3, but for those who aren't, here are some details:
The whole thing still assembled, minus the 160mm fan:
http://img186.imageshack.us/my.php?image=dscn1346sr9.jpg
Both the Cell and the RSX are protected by a heatsink; while the cell is your usual (rather long) core below the heatsink, on the rsx there are 4 GDDR3-chips in each of the 4 corners of the whole chip.
http://img242.imageshack.us/img242/4148/chipsso5.jpg
The heatsink itself is made out of 2 parts, one for the CPU, which is the big part and a small part for the GPU, I think this picture says it all: http://images.dailytech.com/nimage/3000_large_heatsink.jpg (look at the ugly amount of grease stacking up)
The heatsink is fastened on the chips, by some clamps on the other side of motherboard (with other words; it gets "pulled" towards the chips). http://www.consolezombie.com/Images/SonyPS3Disassembly/ps3-heatsink-bracket-screws.jpg
Now, the problem is once you attach the heatsink, you can't move it... This makes so, that I can't twitch the HS to spread the blob/line; is that a big problem or would the Heatsink still do the spreading well enough? Would the break-in help out with that? By using the line-method on the cell and 5 blobs on the rsx (rice-corn in the middle and 4 of about 1/4 the size in each of the corners) managed to avoid fan-stage 5 which it reached with the standard paste; but stage 4 is still too much/loud...
Given I was not happy with the results I went ahead and tried the "spread it yourself"-thing, by wrapping my finger into a plastic bag and creating a nice and even layer. To my happyness this seemed to work quite a bit better, in fact it reached stage 4 a lot later (around 15 minutes later). Still reaching it was not acceptable, so I opened it, to find the CPU Heatsink perfectly covered with AS5, but the GPU-Heatsink barely even touched the RSX :shadedshu I'm sure it was not a mounting mistake as even when I tryed to reseat it, the gpu would not really get into contact with the heatsink, which also explains the tremendous amount of grease Sony put on those chips.
What would you guys do in this situation? I thought about using the "spread it yourself" on the cell, while using the blob (actually 5 blobs, one the size of an uncooked rice corn in the middle and 4 a 1/4 of the size of it on each corner) on the RSX. But then again, when I think about how the Cell got hot, without spreading it myself, I feel kinda unhappy with that choice, or do you think this behaviour would clear up over time (break-in period, I always only tried each config for 2 hours, each with a 20 minute "cool down phase" after the first of the 2 hours.
Is there any way to accelerate the break in, as in get the PS3 really hot (unplug fan/block vents) and let it cool of again once it reaches around stage 10 of fan-level (which is the last before the security turn-off kicks in; I had to do that to burn-in the LMPs on another PS3)?
P.S. Anyone saying something about "dood never open a console", or the like, should just stfu and get out of this thread.
And anyone giving a constructive reply will obviously be rewarded with a "Thanks" and my gratitude!