- Joined
- Sep 29, 2008
- Messages
- 81 (0.01/day)
Processor | Q6600 @ 3.0 |
---|---|
Motherboard | Asus P5K-PRO |
Cooling | Zerotherm ZT-10D |
Memory | 6 GB DDR-II 667 mhz |
Video Card(s) | Gigabyte GTX 960 |
Storage | 2 SATA RAID 0 arrays, 1 SSD |
Display(s) | 23" Wide TFT + 14" 4:3 TFT |
Case | Custom twin tower |
Audio Device(s) | onboard |
Power Supply | Dual PSU mod (2x 550W) Rasurbo BP-XII550 |
Software | Win7 x64 |
Just a word of warning for P5K_Pro users. Because of the pressure applied on the cpu by the cooler (including box-cooler) and the lack of a backside retainer, the PCB starts to bend. The biggest problem is with the MOSFET cooling heatsinks. The deformed shape of the board makes the heatsinks have contact with only 2-3 MOSFTES near the the retainer clips instead of all 12.
The same thing happens to both heatsinks.
To fix the problem i have attached some adhesive rubber pads on the backside of the pcb just on the middle of the heatsink. When the motherboard goes back int-o the case it's beeing forced to keep a normal shape, thus all MOSFTES making contact. I also removed the thermal pads and put some silver based thermal paste.
I'm sorry that i took only one picture:
The same thing happens to both heatsinks.
To fix the problem i have attached some adhesive rubber pads on the backside of the pcb just on the middle of the heatsink. When the motherboard goes back int-o the case it's beeing forced to keep a normal shape, thus all MOSFTES making contact. I also removed the thermal pads and put some silver based thermal paste.
I'm sorry that i took only one picture: